Detailed application of DMP-30 (2,4,6-Tris(dimethylaminomethyl)phenol) in the epoxy resin industry
DMP-30 (CAS 90-72-2) belongs to the tertiary amine phenol modification promoter, and its mechanism of action is to catalyze the ring opening crosslinking between epoxy groups and amines/anhydrides; It can be used as a promoter, a small amount of system, or as a low-temperature curing agent alone.
1. Paired with anhydride curing system (most mainstream)
The curing temperature of anhydride+epoxy resin itself is relatively high and the reaction is slow. Add DMP-30:
- Reduce curing temperature and shorten baking time;
- Reduce the amount of acid anhydride added to improve the toughness of the cured material;
- Improve wettability, reduce pinholes and bubbles.
Typical products:
- Epoxy potting material for electronic components (transformer, transformer, inductor potting)
- Epoxy powder coating, epoxy impregnating paint
- Insulation impregnated resin for motor coils
- Copper clad laminate, FR4 board resin system
2. Paired with polyamide/modified fatty amine system (ambient/medium temperature epoxy adhesive)
The curing speed of polyamide cured epoxy is slow and the low-temperature curing is poor; Add a small amount of DMP-30 as a promoter:
- Accelerate surface drying and complete curing speed;
- Improve the curing ability in low-temperature (5-15 ℃) environments;
- Improve adhesive strength and water resistance.
Typical products:
- Two component epoxy structural adhesive, metal repair adhesive
- Epoxy floor coating, surface coating, epoxy mortar
- Stone dry hanging adhesive, building reinforcement adhesive
- Epoxy anti-corrosion coating for ships and steel structures
3. Paired with aromatic amines and modified aromatic amine high-temperature resistant systems
- Aromatic amine curing system has high curing temperature and long cycle; DMP-30 effectively shortens the high-temperature baking time.
- Application: High temperature resistant epoxy composite materials, aviation composite materials, mold resins.
4. As a low-temperature curing agent alone (low ratio system)
At high addition levels, DMP-30 itself can react and crosslink with epoxy; Mostly used for:
- Quick repair adhesive
- Small electronic quick packaging (rarely used separately, high cost)
5. Summary of Key Segmented Finished Products (For foreign trade, customers can directly reference it)
- Electronics and Electrical
Epoxy sealant, insulation impregnating paint, coil encapsulation resin, high-voltage transformer casting material
- Building floor anti-corrosion
- Two component epoxy floor coating, epoxy anti-corrosion primer, epoxy mortar, repair mortar
- adhesive
Epoxy structural adhesive, stone adhesive, anchoring adhesive, industrial metal bonding adhesive
- Composite materials&insulation materials
Carbon fiber/fiberglass epoxy composite, laminated board, insulation board, mold resin
- Paint industry
Epoxy solvent based anti-corrosion paint, epoxy solvent-free coating, epoxy primer
6. Key points for use (essential for business communication)
- Add quantity reference
Anhydride system: resin total content 0.5% to 3%
Polyamide ambient temperature adhesive: 1% to 5%
- advantage
Good compatibility; Combining promotion and certain toughening; Light color, less prone to severe yellowing (compared to pure tertiary amine)
- shortcoming
The storage period of the system will be shortened; Cannot be used in large quantities for ultra long storage period single component epoxy; Long term high-temperature environment products have a slight yellowing trend.
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